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LT3003
PACKAGE DESCRIPTION
MSE Package
10-Lead Plastic MSOP
(Reference LTC DWG # 05-08-1664)
BOTTOM VIEW OF
EXPOSED PAD OPTION
5.23
(.206)
MIN
2.794 ± 0.102
(.110 ± .004)
2.083 ± 0.102
(.082 ± .004)
0.889 ± 0.127
(.035 ± .005)
3.20 – 3.45
(.126 – .136)
1
2.06 ± 0.102
(.081 ± .004)
1.83 ± 0.102
(.072 ± .004)
10
0.305 ± 0.038 0.50
(.0120 ± .0015) (.0197)
TYP BSC
RECOMMENDED SOLDER PAD LAYOUT
3.00 ± 0.102
(.118 ± .004)
(NOTE 3)
10 9 8 7 6
0.497 ± 0.076
(.0196 ± .003)
REF
0.254
DETAIL “A”
4.90 ± 0.152
(.193 ± .006)
3.00 ± 0.102
(.118 ± .004)
(NOTE 4)
GAUGE PLANE
(.010)
0 ° – 6 ° TYP
1 2 3 4 5
0.18
(.007)
DETAIL “A”
0.53 ± 0.152
(.021 ± .006)
SEATING
1.10
(.043)
MAX
0.86
(.034)
REF
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
PLANE
0.17 – 0.27
(.007 – .011)
TYP
0.50
(.0197)
BSC
0.127 ± 0.076
(.005 ± .003)
MSOP (MSE) 0603
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
3003fa
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
15
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